CMP polishing pad conditioning apparatus

Details CMP polishing pad conditioning apparatus CMP polishing pad conditioning apparatus

1996-06-26

1997-11-04

Rose, Robert A.

Abrading

Abrading process

With tool treating or forming

451443, B24B 5300

Patent

active

056832893

ABSTRACT:
A conditioning end effector apparatus (10) for conditioning a CMP polish pad (40) includes an end effector (20) for contacting CMP polish pad (40). Holder mechanism (12) includes end effector recess (18) for receiving end effector (20). Spacer mechanism (22 or 22') is also located at predetermined locations in end effector recess (18) to associate with end effector openings (26) in end effector (20). End effector (20) firmly attaches through spacer mechanism (22 or 22') to holder mechanism (12) using a fastening device (24). Because of spacer mechanism (22 or 22'), end effector (20) is at distance from recess face (36) to permit slurry (38) that is deposited on CMP polish pad (40) to pass through end effector openings (26).

REFERENCES:
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5531635 (1996-07-01), Mogli et al.

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