CMP polishing heads and methods of using the same

Details CMP polishing heads and methods of using the same CMP polishing heads and methods of using the same

2006-02-14

2006-02-14

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Machine

Rotary tool

C451S289000

Reexamination Certificate

active

06997791

ABSTRACT:
Polishing heads to polish the surface of a semiconductor wafer and methods of using the same are disclosed. A disclosed polishing head includes at least one rotating head to apply a downward force; and a plurality of vacuum cells to hold the wafer via a vacuum force and to convey a least some of the downward force from the at least one rotating head to the wafer.

REFERENCES:
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patent: 6764387 (2004-07-01), Chen
patent: 6769966 (2004-08-01), Okamura et al.
patent: 6769973 (2004-08-01), Boo et al.

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