CMP pad with designed surface features

Details CMP pad with designed surface features CMP pad with designed surface features

2007-06-05

2007-06-05

Wilson, Lee D. (Department: 3723)

Abrading

Machine

Rotary tool

C451S041000, C451S056000, C451S287000, C051S302000

Reexamination Certificate

active

11297964

ABSTRACT:
A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality of polishing structures form a temporary reservoir region for the polishing composition. The second material is harder than the first material.

REFERENCES:
patent: 4393628 (1983-07-01), Ottman et al.
patent: 4466218 (1984-08-01), Ottman et al.
patent: 4613345 (1986-09-01), Thicke et al.
patent: 5020283 (1991-06-01), Tuttle
patent: 5152917 (1992-10-01), Pieper et al.
patent: 5177908 (1993-01-01), Tuttle
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5304223 (1994-04-01), Pieper et al.
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5394655 (1995-03-01), Allen et al.
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5435816 (1995-07-01), Spurgeon et al.
patent: 5454844 (1995-10-01), Hibbard et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5516409 (1996-05-01), Kambara
patent: 5549961 (1996-08-01), Haas et al.
patent: 5558563 (1996-09-01), Cote et al.
patent: 5564965 (1996-10-01), Tanaka et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5609719 (1997-03-01), Hempel
patent: 5624304 (1997-04-01), Pasch et al.
patent: 5628862 (1997-05-01), Yu et al.
patent: 5645469 (1997-07-01), Burke et al.
patent: 5650039 (1997-07-01), Talieh
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5690540 (1997-11-01), Elliott et al.
patent: 5692950 (1997-12-01), Rutherford et al.
patent: 5725417 (1998-03-01), Robinson
patent: 5725420 (1998-03-01), Torii
patent: 5738567 (1998-04-01), Manzonie et al.
patent: 5759918 (1998-06-01), Hoshizaki et al.
patent: 5769699 (1998-06-01), Yu
patent: 5778481 (1998-07-01), Amsden et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5785584 (1998-07-01), Marmillion et al.
patent: 5842910 (1998-12-01), Krywanczyk et al.
patent: 5871392 (1999-02-01), Meikle et al.
patent: 5876269 (1999-03-01), Torii
patent: 5888121 (1999-03-01), Kirchner et al.
patent: 5888126 (1999-03-01), Hirose et al.
patent: 5893755 (1999-04-01), Nakayoshi
patent: 5899745 (1999-05-01), Kim et al.
patent: 5899799 (1999-05-01), Monzonie et al.
patent: 5900164 (1999-05-01), Budinger et al.
patent: 5910043 (1999-06-01), Manzonie et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5932486 (1999-08-01), Cook et al.
patent: 5934977 (1999-08-01), Marmillion et al.
patent: 5958794 (1999-09-01), Bruzvoort et al.
patent: 5984769 (1999-11-01), Bennett et al.
patent: 6007407 (1999-12-01), Rutherford et al.
patent: 6030899 (2000-02-01), Cook et al.
patent: 6117775 (2000-09-01), Kondo et al.
patent: 6390891 (2002-05-01), Guha et al.
patent: 6520843 (2003-02-01), Halley
patent: 6620031 (2003-09-01), Renteln
patent: 6679769 (2004-01-01), Pinheiro et al.
patent: 6776699 (2004-08-01), Amano et al.
patent: 0845328 (1998-06-01), None
patent: 0874390 (1998-10-01), None
patent: 0919336 (1999-06-01), None
patent: WO 99/55493 (1999-11-01), None
Lawig, A. Scott; “Pad Conditioning and Pad Surface Characterization in Oxide Chemical Mechanical Polishing”; 2002,Mat. Res. Soc. Symp. Proc., vol. 732E, pp. 5.3.1-5.3.6.
Lee, Sunghoon et al.; “Micro Feature Pad Development and Its Performance in Chemical Mechanical Planarization”; 2004,Mat. Res. Soc. Symp. Proc., vol. 818, pp. K.5.1.1-K.5.1.5.
Lee, Sunghoon et al.; “Design rules for CMP pad based on pad-characterization and its protype fabrication using micro molding”; 2005,9th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, 8 pages.
Lee, Sunghoon et al.;“Performance of a novel controlled-contact area pad for CMP”;Department of Mechanical Engineering, University of California, 1 page.
Lee, Sunghoon et al.;“Design rules for CMP pad based on pad-characterization and its protype fabrication using micro molding”; 2005,CMP-MIC, 2 pages.
Lee, Sunghoon et al.;“Study on the effects of pad design in CMP”; 2005,2nd Pac-rim international conference on planarization CMP and its application technology,4 pages.
Yoshida, Takafumi; “Pad Asperity Parameters for CMP Process Simulation”; 2004,Mat. Res. Soc. Symp. Proc., vol. 816, pp. K.8.4.1-K.8.4.6.

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