CMP pad having unevenly spaced grooves

Details CMP pad having unevenly spaced grooves CMP pad having unevenly spaced grooves

2007-09-11

2007-09-11

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Work face variegated or on projecting backing

C451S527000

Reexamination Certificate

active

11512994

ABSTRACT:
A chemical mechanical polishing pad (100) having a circular polishing track (124) and a concentric center (116). The polishing pad (100) includes a polishing layer (104) having a groove pattern containing a plurality of grooves (128) each extending through the polishing track (124). The plurality of grooves have an angular pitch that varies in a circumferential direction about the concentric center (116) of the pad (100) and the radial pitch between all adjacent grooves (128) within the wafer track (124) is unequal.

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