CMP pad having isolated pockets of continuous porosity and a...

Details CMP pad having isolated pockets of continuous porosity and a... CMP pad having isolated pockets of continuous porosity and a...

2005-03-08

2005-03-08

Nguyen, George (Department: 3723)

Abrading

Machine

Rotary tool

C451S288000

Reexamination Certificate

active

06863599

ABSTRACT:
A chemical mechanical polishing pad and a system and a method for using such a pad are described. The polishing pad includes pockets of continuous porosity, each of the pockets being separated from the other pockets by a non-porous matrix. The non-porous matrix may include a network of trenches, or may have pores which have been filled with a material. The material may include a polymer resin. A system for polishing a wafer includes the polishing pad mounted on a platen. A drive assembly creates relative rotation between the wafer and the polishing pad through a drive shaft. The drive shaft may be connected to the platen or it may be connected to a wafer holder which holds the wafer. Alternatively, one drive shaft may be connected to the platen and another drive shaft may be connected to the wafer holder, and a pair of drive assemblies drive the drive shafts.

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