CMP pad having an overlapping stepped groove arrangement

Details CMP pad having an overlapping stepped groove arrangement CMP pad having an overlapping stepped groove arrangement

2006-06-13

2006-06-13

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S530000

Reexamination Certificate

active

07059949

ABSTRACT:
A polishing pad (104, 300) having an annular polishing track (152, 320) and a plurality of groups (160, 308) of grooves (112, 304) repeated circumferentially about the rotational center (128) of the pad. The plurality of grooves in each group are arranged along a trajectory (164, 312) in an offset and overlapping manner so as to provide a plurality of overlapping steps (172, 316) within the annular polishing track. The groups may be arranged in spaced-apart or nested relation with one another.

REFERENCES:
patent: 5177908 (1993-01-01), Tuttle
patent: 5645469 (1997-07-01), Burke et al.
patent: 5650039 (1997-07-01), Talieh
patent: 5990012 (1999-11-01), Robinson et al.
patent: 6089966 (2000-07-01), Arai et al.
patent: 6120366 (2000-09-01), Lin et al.
patent: 6241596 (2001-06-01), Osterheld et al.
patent: 6843711 (2005-01-01), Muldowney
patent: 2002/0068516 (2002-06-01), Chen et al.
patent: 2002/0083577 (2002-07-01), Suzuki
patent: 1 114 697 (2001-07-01), None

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