CMP pad having a streamlined windowpane

Details CMP pad having a streamlined windowpane CMP pad having a streamlined windowpane

2007-02-27

2007-02-27

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S527000

Reexamination Certificate

active

11166940

ABSTRACT:
A chemical mechanical polishing pad (200, 300, 400, 500, 600) that includes a translucent windowpane (220, 320, 404, 516, 524, 604) that allows optical measurements to be made using light energy reflected from the surface of a wafer (212, 324, 608) or other object being polished. The windowpane includes a trailing end (350, 416, 632) and a leading end (348, 412, 628) each having a streamlined shape so as to reduce the disturbance to the flow of a polishing medium (216) around the windowpane. The polishing pad may further include grooves (336, 428, 520, 640) that are diverted around the windowpane so as to provide a continuous path for the polishing medium in the region of the windowpane.

REFERENCES:
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 6454630 (2002-09-01), Tolles
patent: 6752690 (2004-06-01), Fruitman
patent: 2005/0060943 (2005-03-01), Turner et al.
patent: 2005/0245171 (2005-11-01), Hosaka et al.

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