CMP pad having a radially alternating groove segment...

Abrading – Machine – Scouring device

Reexamination Certificate

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Details

C451S285000, C451S527000, C451S530000

Reexamination Certificate

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07131895

ABSTRACT:
A polishing pad (104) having an annular polishing track (122) and including a plurality of grooves (148) that each traverse the polishing track. Each groove includes a plurality of flow control segments (CS1–CS3) and at least two discontinuities in slope (D1, D2) located within the polishing track.

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patent: 6783436 (2004-08-01), Muldowney
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patent: 6843711 (2005-01-01), Muldowney
patent: 6955587 (2005-10-01), Muldowney
patent: 6958002 (2005-10-01), Palaparthi
patent: 2002-0022198 (2002-03-01), None
US 6,273,808, 08/2001, Bennett et al. (withdrawn)

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