CMP pad conditioner

Abrading – Accessory – Dressing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07540802

ABSTRACT:
A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.

REFERENCES:
patent: 6001008 (1999-12-01), Fujimori et al.
patent: 6213856 (2001-04-01), Cho et al.
patent: 6325709 (2001-12-01), Nanda et al.
patent: 6884155 (2005-04-01), Sung et al.
patent: 2003/0084894 (2003-05-01), Sung
patent: 2005/0215188 (2005-09-01), Toge et al.
patent: A 2001-113456 (2001-04-01), None
patent: A 2003-305644 (2003-10-01), None
patent: A 2005-161440 (2005-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

CMP pad conditioner does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with CMP pad conditioner, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CMP pad conditioner will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4079509

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.