Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2007-07-10
2007-07-10
Nguyen, Dung Van (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S008000, C451S011000
Reexamination Certificate
active
11383052
ABSTRACT:
An ultrasonic CMP polishing pad analyzer is disclosed. The analyzer provides a manufacturer or other user an ability to inspect a CMP polishing pad without removing the pad from the CMP machine by creating and displaying a topographical image of an in-service polishing pad. The analyzer includes an ultrasonic transducer and an analyzer body mounted to the CMP machine such that the ultrasonic transducer is positioned to receive reflected ultrasonic signals from a surface of the polishing pad.
REFERENCES:
patent: 6186864 (2001-02-01), Fisher et al.
patent: 6684704 (2004-02-01), Obeng
patent: 7033246 (2006-04-01), Elledge et al.
patent: 2004/0043521 (2004-03-01), Elledge
Bhardwaj Mahesh S.
Biviano Michael S.
Eischeid Thomas J.
Oaks Bradley S.
Srivatsa Raghu S.
Nguyen Dung Van
The Ultran Group, Inc.
The Webb Law Firm
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