CMP method for noble metals

Details CMP method for noble metals CMP method for noble metals

2006-08-29

2006-08-29

Shakeri, Hadi (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C051S307000, C252S079100, C257SE21304, C438S693000

Reexamination Certificate

active

07097541

ABSTRACT:
The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP system comprises an abrasive and/or polishing pad, a liquid carrier, and a sulfonic acid compound.

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