CMP formulations

Details CMP formulations CMP formulations

2005-09-20

2005-09-20

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

C451S036000

Reexamination Certificate

active

06945851

ABSTRACT:
CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respectively and optionally an organic carboxylic acid.

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patent: 6755721 (2004-06-01), Ward et al.
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patent: 2003/0134575 (2003-07-01), Fang
patent: 0 280 438 (1998-08-01), None
patent: WO 01/12740 (2001-02-01), None
patent: WO 01/36554 (2001-05-01), None
patent: WO 01/74959 (2001-10-01), None
patent: WO 03/31527 (2003-04-01), None

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