CMP equipment for use in planarizing a semiconductor wafer

Details CMP equipment for use in planarizing a semiconductor wafer CMP equipment for use in planarizing a semiconductor wafer

2005-05-31

2005-05-31

Hail, III, Joseph J. (Department: 3723)

Abrading

Work holder

Vacuum

C451S041000, C451S056000, C451S060000, C451S287000, C451S288000, C451S443000, C451S444000, C451S446000

Reexamination Certificate

active

06899609

ABSTRACT:
Chemical mechanical polishing (CMP) equipment for use in planarizing a semiconductor wafer prevents slurry from being deposited on the surfaces of respective components of the equipment. The CMP equipment includes a turntable, a polishing pad mounted to the table so as to rotate with the table, a slurry supply unit for dispensing slurry onto the polishing pad, a polishing head unit for pressing a wafer downward atop the polishing pad, a conditioning unit for scoring the pad to maintain the surface of the polishing pad uniform, and a cleaning fluid supply unit. The cleaning solution supply unit has at least one spray nozzle by which cleaning solution is sprayed onto the polishing pad and respective components of the CMP equipment.

REFERENCES:
patent: 6206760 (2001-03-01), Chang et al.
patent: 6402598 (2002-06-01), Ahn et al.
patent: 6405399 (2002-06-01), Farber et al.
patent: 6595831 (2003-07-01), Hirokawa et al.

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