CMP diamond conditioning disk

Details CMP diamond conditioning disk CMP diamond conditioning disk

2007-11-27

2007-11-27

Wilson, Lee D. (Department: 3723)

Abrading

Accessory

Dressing

C451S056000, C451S072000, C451S533000, C051S295000

Reexamination Certificate

active

11508654

ABSTRACT:
A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.

REFERENCES:
patent: 5152810 (1992-10-01), Rue et al.
patent: 5492771 (1996-02-01), Lowder et al.
patent: 6368198 (2002-04-01), Sung et al.
patent: 6517424 (2003-02-01), Wielonski et al.
patent: 6702654 (2004-03-01), Nanda et al.
patent: WO2004086477 (2004-10-01), None

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