CMP device and production method for semiconductor device

Details CMP device and production method for semiconductor device CMP device and production method for semiconductor device

2005-07-05

2005-07-05

Eley, Timothy V. (Department: 3724)

Abrading

Machine

Reciprocating tool

C451S285000, C451S287000, C451S290000

Reexamination Certificate

active

06913525

ABSTRACT:
A triangular pad of the type shown in FIG.5(a) which has circular tip ends is used as the polishing pad. This shape corresponds to the concept of partially cutting the outer edge of the polishing pad in order to shorten the contact time of the polishing pad and wafer at the outer circumference of the wafer regardless of the swing speed. As shown in the figure, a circular bored part with a diameter of 50 mm is provided in the center of such a polishing pad. By using this polishing pad and dividing the swing width into ten, it is possible to keep the product of the integrated value of the relative linear velocity, the integrated value of the pressure, and the integrated value of the contact time at various points within the wafer surface within ±30% of the mean value in each swing width under feasible swing conditions. Thus, the use of such a polishing pad makes it possible to perform uniform polishing.

REFERENCES:
patent: 5800253 (1998-09-01), Ikemoto
patent: 5931722 (1999-08-01), Ohmi et al.
patent: 5975997 (1999-11-01), Minami
patent: 6106369 (2000-08-01), Konishi et al.
patent: 6159080 (2000-12-01), Talieh
patent: 6270392 (2001-08-01), Hayashi et al.
patent: 6299506 (2001-10-01), Nishimura et al.
patent: 6602121 (2003-08-01), Halley
patent: 10-015810 (1998-01-01), None
patent: 10-180622 (1998-07-01), None
patent: 2000-757 (2000-01-01), None

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