Abrading – Abrading process
Reexamination Certificate
2006-03-20
2008-12-16
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
C451S056000, C451S443000, C451S548000, C051S295000, C051S297000, C051S309000
Reexamination Certificate
active
07465217
ABSTRACT:
Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of the support member, wherein the plurality of hard abrasive grains are regularly arranged on the surface of the support member. The CMP conditioner according to the second aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on the surface of the support member, wherein the plurality of hard abrasive grains are arranged on the surface of the support member regularly and so as for the density of the hard abrasive grains to decrease from the inner side of the support member toward the outer side of the support member.
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Patent Abstracts of Japan, JP 10-193269, Jul. 28, 1998.
Araki Ryuichi
Hashino Eiji
Kinoshita Toshiya
Sato Setsuo
Kenyon & Kenyon LLP
Morgan Eileen P.
Nippon Steel Corporation
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