CMP composition containing organic nitro compounds

Details CMP composition containing organic nitro compounds CMP composition containing organic nitro compounds

2006-12-12

2006-12-12

Norton, Nadine (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C252S079100, C252S079400

Reexamination Certificate

active

07148147

ABSTRACT:
A composition and process for the precision polishing of substrates such as semi-conductor chips is disclosed. The composition and process make use of soluble or insoluble organic nitro compounds as oxidizers and/or abrasive particles. Nitrogen containing reduction products of the foregoing organic nitro compounds may also be included.

REFERENCES:
patent: 3738858 (1973-06-01), Elwell et al.
patent: 5770103 (1998-06-01), Wang et al.
patent: 5782962 (1998-07-01), Burke et al.
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6524376 (2003-02-01), Aoki et al.
patent: 2002/0016073 (2002-02-01), Kondo et al.
patent: 60032898 (1985-02-01), None

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