CMP composition and process

Details CMP composition and process CMP composition and process

2005-10-18

2005-10-18

Marcheschi, Michael (Department: 1755)

Abrading

Abrading process

Utilizing fluent abradant

C438S692000, C438S693000, C216S089000, C216S096000, C216S105000, C051S307000, C051S308000, C051S309000, C106S003000

Reexamination Certificate

active

06955586

ABSTRACT:
The present invention provides a chemical metal polishing (CMP) method with improved flexibility and improved processing window, especially as it relates to the chemical aspect of CMP technology. Broadly speaking, the invention has two aspects: according to one aspect, the invention provides a new CMP composition, comprising as an oxidizer, at least one of inorganic halogen derivative and dissolved oxygen while in a second aspect the invention provides an improved method for polishing metals.

REFERENCES:
patent: 5334281 (1994-08-01), Doerre et al.
patent: 6074287 (2000-06-01), Miyaji et al.
patent: 6117780 (2000-09-01), Tsai et al.
patent: 6448182 (2002-09-01), Hall et al.
patent: 6720264 (2004-04-01), Sahota et al.
patent: 2002/0177316 (2002-11-01), Miller et al.
patent: WO 01/44396 (2001-06-01), None
patent: WO 02/083804 (2002-10-01), None

Affiliated with

Also associated with

Rating

CMP composition and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with CMP composition and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CMP composition and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3456524