CMP apparatus, CMP polishing method, semiconductor device...

Details CMP apparatus, CMP polishing method, semiconductor device... CMP apparatus, CMP polishing method, semiconductor device...

2005-08-09

2005-08-09

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S005000, C451S036000

Reexamination Certificate

active

06926587

ABSTRACT:
A CMP apparatus is provided for polishing wafers that are substrates to be polished by CMP. The CMP apparatus comprises a stage that is structured to be rotatable and holds a wafer to be polished, a polishing head holding section that holds a polishing head equipped with a polishing pad over the stage, a polishing head storage section that stores replacement polishing heads equipped with polishing pads; and a polishing head replacement mechanism that replaces the polishing head held by the polishing head holding section with the replacement polishing heads stored in the polishing head storage section.

REFERENCES:
patent: 6111634 (2000-08-01), Pecen et al.
patent: 6336845 (2002-01-01), Engdahl et al.
patent: 6346036 (2002-02-01), Halley
patent: 6520895 (2003-02-01), Senga et al.
patent: 6527621 (2003-03-01), Halley
patent: 6729943 (2004-05-01), Kistler et al.
patent: 6776692 (2004-08-01), Zuniga et al.

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