CMOS process for fabricating integrated circuits, particularly d

Metal working – Method of mechanical manufacture – Assembling or joining

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29571, 29576W, 29577C, 29578, 29590, 148175, 148DIG14, 148DIG43, 148DIG51, 148DIG106, 148DIG117, 156643, 156653, 156657, 1566591, 357 51, 357 54, 357 59, 357 236, H01L 21306, H01L 2131

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045369470

ABSTRACT:
A CMOS process is described which is particularly suited for forming dynamic memory cells. The cells are formed in an n-well and a single plate member formed from a first layer of polysilicon is used for the entire array. Unique etching of the first polysilicon layer prevents stringers from occurring when the second layer of polysilicon is deposited. A tri-layer dielectric is used for the capacitors in the array. Novel "rear-end" processing is disclosed using a phosphorus doped glass.

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