CMOS integrated circuit device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 237, H01L 2702

Patent

active

046225714

ABSTRACT:
There is provided a CMOSIC device including: first and second regions of a semiconductor substrate of a first conductivity type, the first and second regions being surrounded and isolated by a field insulating film formed in and on a major surface of the semiconductor substrate; a first MOS transistor which is formed in the first region and which has a source and a drain of a second conductivity type; a third region which is formed in the second region and which has a low resistance; and epitaxial layer of the second conductivity which is grown on the third region and which has a high resistance; and a second MOS transistor which is formed in the epitaxial layer and which has source and drain of the first conductivity type. The width of the field insulating film can be reduced to about half of that of the conventional field insulating film, thus improving the packing density of the semiconductor device.

REFERENCES:
patent: 4041518 (1977-08-01), Shimizu
patent: 4314858 (1982-02-01), Tomasetta et al.
patent: 4353085 (1982-10-01), Sakurai
patent: 4402002 (1983-08-01), Sanders et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

CMOS integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with CMOS integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CMOS integrated circuit device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-379623

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.