CMOS image sensor and method for fabricating the same

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C257S432000, C257SE31127

Reexamination Certificate

active

08030116

ABSTRACT:
A CMOS image sensor and a method for fabricating the same are disclosed. The method includes forming a plurality of color filters on a substrate, each color filter having a curvature, and forming microlenses on the color filters that each has a radius of curvature that varies with the wavelength of the color filter on which it is formed.

REFERENCES:
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patent: 2006/0231898 (2006-10-01), Jeong et al.
patent: 2007/0102621 (2007-05-01), Kim
patent: 2007/0145422 (2007-06-01), Park
patent: 2008/0258249 (2008-10-01), Hong
patent: 2009/0200623 (2009-08-01), Qian et al.
patent: 10-2006-0077064 (2006-07-01), None
patent: 10-2007-0071016 (2007-07-01), None
Korean Office Action dated Jun. 23, 2010; Korean Patent Application No. 10-2008-0090718; Korean Intellectual Property Office, Republic of Korea.
Eun Ji Kim; “CMOS Image Sensor Having Triple Micro-Lens Structure and Method for Manufacturing the Same”; Korean Patent Abstracts; Publication No. 1020060077064 A; Publication Date: Jul. 5, 2006; Korean Intellectual Property Office, Republic of Korea.
Won Ho Lee; “Image Sensor and its Fabricating Method to Increase the Quantity of the Light Irradiated to a Photodiode Through Each Color Filter”; Korean Patent Abstracts; Publication No. 1020070071016 A; Publication Date: Jul. 4, 2007; Korean Intellectual Property Office, Republic of Korea.

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