Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2006-10-31
2006-10-31
Wojciechowicz, Edward (Department: 2815)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C257S225000, C438S073000
Reexamination Certificate
active
07129108
ABSTRACT:
A CMOS image sensor according to the present invention includes a substrate having a light receiving region, an interlayer insulating film formed on the substrate, a plurality of metal wirings formed on the interlayer insulating film so as to expose the light receiving region, a protection layer coated on the metal wirings and the interlayer insulating film, and a plurality of color filters formed on the protection layer, wherein at least one of the color filters is provided with an isolation layer formed on an upper surface thereof.
REFERENCES:
patent: 4600833 (1986-07-01), Shibata et al.
patent: 5719074 (1998-02-01), Hawkins et al.
patent: 5841126 (1998-11-01), Fossum et al.
patent: 5886659 (1999-03-01), Pain et al.
patent: 5990506 (1999-11-01), Fossum et al.
patent: 6005619 (1999-12-01), Fossum
patent: 6021172 (2000-02-01), Fossum et al.
patent: 6852565 (2005-02-01), Zhao
patent: 2003/0071271 (2003-04-01), Suzuki et al.
patent: 2-3968 (1990-01-01), None
Satoshi Uchiya; Manufacture of Solid-State Colored Image Sensing Element; Patent Abstracts of Japan; Publication No. 02-003968; Publication Date Jan. 9, 1990; 1 Pg.; Japan Patent Office; 1998, 2003.
Dongbu Electronics Co. Ltd.
Fortney Andrew D.
Wojciechowicz Edward
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