Clustering adapter for spherical shaped devices

Details Clustering adapter for spherical shaped devices Clustering adapter for spherical shaped devices

1998-03-26

1999-03-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361767, 361768, 257618, 257678, 257686, 257730, 257737, 438109, 438125, 438613, 439 68, 174 521, H05K 702, H01L 2906

Patent

active

058779434

ABSTRACT:
An apparatus and method for connecting and interconnecting spherical ICs. The apparatus includes an enclosure which is used to hold and secure one or more spherical ICs or to connect to a device such as a printed circuit board. The enclosure includes two groups of electrical contact points. These contact points may be solder bumps, pads, leads, or any other type of connector. One group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the first spherical shaped IC and the other group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the other device. The two groups of enclosure contact points are interconnected with each other through a circuit located inside the enclosure. As a result, alignment is no longer required by the contact points on the spherical shaped IC and the other device.

REFERENCES:
patent: 3328741 (1967-06-01), Brown
patent: 3459873 (1969-08-01), Harris et al.
patent: 4036543 (1977-07-01), Taketomi
patent: 4094751 (1978-06-01), Nozik
patent: 5018980 (1991-05-01), Robb

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