Cluster compound microelectronic component

Details Cluster compound microelectronic component Cluster compound microelectronic component

1993-03-31

1994-09-27

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Thin active physical layer which is

Heterojunction

257 12, 257 28, 257183, H01L 2712, H01L 29161

Patent

active

053509307

ABSTRACT:
The invention relates to a microelectronic component with a component body determining the electronic properties of the component and functioning on the basis of a quantum wire or quantum point system. The the component body is formed of at least one, but in most cases a plurality of cluster molecules which adjoin one another, and the cluster molecules are formed of a metallic cluster nucleus and nonmetallic (insulating) ligand shell externally shielding and stabilizing the cluster nucleus. The cluster nucleus of the cluster molecules is formed of atoms of a transition metal, preferably silver (Ag), gold (Au), cobalt (Co), palladium (Pd), platinum (Pt), rhodium (Rh), Ruthenium (Ru).

REFERENCES:
patent: 3893148 (1975-07-01), Madjid
patent: 5032877 (1991-07-01), Bate
patent: 5037732 (1991-08-01), McDugle et al.
patent: 5059001 (1991-10-01), Shimizu
patent: 5182788 (1993-01-01), Tanaka
patent: 5253258 (1993-10-01), Lawandy
Physik in unserer Zeit (Physics Today), 23. 1993, vol. 4, pp. 159-165.
Scientific American, "Single Electronics", Jun. 1992, pp. 50-55.
Materials Research Society, Apr., 1992, pp. 157-175.
Spektrum der Wissenschaft, Issue 1991, p. 28 ff J. Vac. Sci. Technol., B 8 (2), 1990, 242, 245.
Rompp Chemie Lexikon, 9th edition, vol. 1, 1989, pp. 754, 755.

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