Closure device for shrinkwraps

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 86, 264230, 264342R, 428 40, B32B 3126

Patent

active

050229419

ABSTRACT:
A closure device for shrinkwraps comprising a high temperature-resistant, flame-resistant and dimensionally stable backing layer, a cross linked, high temperature-resistant, shear-resistant, and flame-resistant pressure sensitive adhesive applied to one surface of the backing layer; a heat-shrinkable film dimensionally smaller than the pressure sensitive adhesive layer positioned on the adhesive layer so as to maintain a peripheral area of exposed pressure sensitive adhesive; and an optional release liner applied so as to protect the exposed pressure sensitive adhesive layer from premature and unwanted contact prior to use.

REFERENCES:
patent: 4356222 (1982-10-01), Harakawa et al.
patent: 4424246 (1984-01-01), Pieslak et al.
patent: 4586971 (1986-05-01), Wallace

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Closure device for shrinkwraps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Closure device for shrinkwraps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Closure device for shrinkwraps will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-780991

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.