Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2002-07-25
2004-02-10
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S834000, C439S862000
Reexamination Certificate
active
06688892
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a clip-type lead frame and an electric device with two substrates electrically connected by the lead frame.
BACKGROUND OF THE INVENTION
Conventionally, there have been proposed a number of clip-type lead frames for electrically connecting a main substrate with a sub-substrate or semiconductor device provided on the main substrate. For this purpose, each of the proposed clip-type lead frames has pairs of clip-type lead pins. The paired lead pins are so sized and shaped that they clip and hold the sub-substrate or semiconductor device and, simultaneously, make contacts with corresponding connection pads, if any, provided on a periphery of the sub-substrate or semiconductor device.
For example, a variety of clip-type lead frames have been proposed in Japanese Patent Laid-open Publication Nos. 7-320801, 7-230837, 9-83132 and 5-101854 and Japanese Utility Model Laid-open Publication Nos. 2-8877 and 2-88248. Typically, each of the lead frames proposed in the applications has a specific structure similar to that described in FIG.
9
.
Referring to
FIG. 9
, a memory board
100
or sub-substrate mounted on a main-substrate
200
by means of clip-type lead frames
110
and
120
of the same size and structures. For clarity, electric wires provided on the main-substrate
200
are omitted from the drawing. The memory pad
100
supports connection pads
102
,
104
and
106
on a peripheral portion of its upper surface and another connection pads
101
,
103
,
105
and
107
on the opposite peripheral portion of its lower surface at regular intervals.
As can be seen from the drawing, the clip-type lead frame
110
or
120
has lead pins
121
-
127
corresponding to connection pads
101
-
107
provided on the upper and lower peripheral portions of the memory board
100
. The lead pins
121
,
123
,
125
and
127
are provided in places corresponding to the lower connection pads of the memory board
100
. The lead pins
122
,
124
,
126
, on the other hand, are provided in places corresponding to the upper connection pads of the memory board
100
. A vertical gap between the lower and upper lead pins is determined so that, when once engaged with the memory board
100
, they clip and then hold the memory board
100
.
However, the vertical gap between the upper and lower pins is fixed, which makes it impossible to apply one lead frame for various semiconductors or sub-substrates having different thicknesses.
SUMMARY OF THE INVENTION
Therefore, a purpose of the present invention is to provide a clip-type lead frame having flexibility to several boards with different thickness caused by not only an uneven product quality but also several different type products.
To this end, a clip-type lead frame for mounting a first substrate with connection pads on its peripheral portion on a second substrate, comprising: a support made of electrically insulative material; and a first pin and a second lead pin made of electrically conductive material and mounted in the support so that an upper portion of first lead pin opposes to an upper portion of the second lead pin with leaving a gap therebetween for clipping and holding the first substrate, wherein at least one of the first and second lead pins has a mechanism for adjusting the gap between the opposing upper portions of the first and second pins.
In another aspect of the present inventions, the upper portions of the first and second lead pin are positioned so that the upper portion of the first lead pin makes a contact with an upper surface of the first substrate and the upper portion of the second lead pin makes a contact with a lower surface of the first substrate, and wherein the adjust mechanism is provided to the first lead pin.
In another aspect of the present inventions, the upper portions of the first and second lead pin are positioned so that the upper portion of the first lead pin makes a contact with an upper surface of the first substrate and the upper portion of the second lead pin makes a contact with a lower surface of the first substrate, and wherein the adjust mechanism is provided to the second lead pin.
In another aspect of the present inventions, the mechanism comprises an upper part of the lead pin, a lower part of the lead pin separated from the upper part of the lead pin, and a holder defined in one of the upper part and the lower part of the lead pin for holding the other of the upper part and the lower part of the lead pin. Also, the remaining part of the of the lead pin has a deformation for preventing a slip between the upper part and the lower part of the lead pin. Preferably, the deformation may be a corrugated portion.
In another aspect of the present inventions, the mechanism has an angled section.
In another aspect of the present inventions, the support has an insulating portion which opposes to a peripheral portion of the first substrate held between the first and second lead pins.
REFERENCES:
patent: 3027440 (1962-03-01), Daly
patent: 3066367 (1962-12-01), Garman
patent: 3479634 (1969-11-01), Pritulsky
patent: 3689684 (1972-09-01), Cox et al.
patent: 3764955 (1973-10-01), Ward
patent: 3790916 (1974-02-01), Keitel
patent: 3924918 (1975-12-01), Friend
patent: 3933405 (1976-01-01), Patterson et al.
patent: 3941442 (1976-03-01), Friend
patent: 4018496 (1977-04-01), Bilsback
patent: 4025162 (1977-05-01), Yagi
patent: 4350403 (1982-09-01), Seytre et al.
patent: 4362353 (1982-12-01), Cobaugh et al.
patent: 4384757 (1983-05-01), Andrews et al.
patent: 4555151 (1985-11-01), Neese et al.
patent: 4592617 (1986-06-01), Seidler
patent: 4647126 (1987-03-01), Sobota, Jr.
patent: 5191404 (1993-03-01), Wu et al.
patent: 5910885 (1999-06-01), Gulachenski et al.
patent: 6163461 (2000-12-01), Watanabe
patent: 6312263 (2001-11-01), Higuchi et al.
patent: 2-8877 (1990-01-01), None
patent: 2-88248 (1990-07-01), None
patent: 5-101854 (1993-04-01), None
patent: 7-230837 (1995-08-01), None
patent: 7-320801 (1995-12-01), None
patent: 9-83132 (1997-03-01), None
Fukumoto Takakazu
Maeda Hajime
Takeoka Tetsuya
Gushi Ross
Renesas Technology Corp.
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