Clip-on heat sink and method of cooling a computer chip package

Details Clip-on heat sink and method of cooling a computer chip package Clip-on heat sink and method of cooling a computer chip package

1992-02-03

1994-03-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361756, 361752, 165185, 257720, 174 163, H05K 720

Patent

active

052950433

ABSTRACT:
A low-profile, clip-on heat sink for computer chip packages that releasably engages the side of the package and method for cooling computer chips is disclosed. The sink comprises a contact pad attached to a set of beams. Flanges extend down from the outer edges of the beams. The sink is engaged to the package by the flanges which attach to the sides of the package. When the sink is engaged to the package, the contact pad contacts the computer chip. When the chip is operating, heat flows from the chip to the contact pad. Heat then flows from the contact pad to the beams where it dissipates into the ambient surroundings. The sink may be released from engagement by deforming the flanges.

REFERENCES:
patent: 4345267 (1982-08-01), Corman et al.
patent: 4594643 (1986-06-01), Hermann
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4716494 (1987-12-01), Bright et al.
European Search Report dated Mar. 29, 1993.
Computer Design Magazin, p. 73; EG&G Wakefield Engineering Series heat sink/clip assembly--Feb. 1992.
Semiconductor Accessories Brochure; Thermalloy, Inc., Dec. 1990.

Affiliated with

Also associated with

Rating

Clip-on heat sink and method of cooling a computer chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clip-on heat sink and method of cooling a computer chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clip-on heat sink and method of cooling a computer chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1539665