Clip-on heat sink

Details Clip-on heat sink Clip-on heat sink

1998-03-09

2000-08-15

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

24455, 165 803, 174 163, 257719, 361722, H05K 720

Patent

active

061046124

ABSTRACT:
The heat sink (10) of the present invention is used to absorb and dissipate heat from a solid-state device. The heat sink (10) comprises a generally U-shaped body (18) of a thermally conductive material. The U-shaped body (18) comprises two continuous legs (20, 22) having widths greater than the width of the solid-state device.

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"Kuhlkorper fur Halbleiterbauelement im Plastikgehause," Feinwerk Technik, vol. 75, No. 7, 1971 p. 334 XP-002104611 DE., 1 page.

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