Clip on heat exchanger for a memory module and assembly method

Details Clip on heat exchanger for a memory module and assembly method Clip on heat exchanger for a memory module and assembly method

1997-12-17

1999-10-12

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361710, 361715, H05K 720

Patent

active

059662875

ABSTRACT:
An apparatus for dissipating heat generated by electronic components on a surface of a memory module and a method of assembling the apparatus are provided. The apparatus includes substantially identical first and second heat exchanger members, each having a heat spreader member thermally coupled to a heat sink member. The two heat exchanger members are positioned on opposing sides of a memory module and assembled together about the module. A surface of the heat spreader member is configured to engage electronic components on the surface of the memory module. A clip member protruding from an edge of each heat exchanger member is also provided. The first heat exchanger clip member is configured to engage an edge of the second heat exchanger member and the second heat exchanger clip is configured to engage an edge of the first heat exchanger member to releasably lock the first and second heat exchanger members together about the memory module.

REFERENCES:
patent: 5109318 (1992-04-01), Funari et al.
patent: 5473511 (1995-12-01), Reddy et al.
patent: 5671122 (1997-09-01), Schoettl et al.

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