Clip head apparatus for retaining a semiconductor wafer on a ped

Details Clip head apparatus for retaining a semiconductor wafer on a ped Clip head apparatus for retaining a semiconductor wafer on a ped

1995-06-06

1997-08-19

Watson, Robert C.

Work holders

Relatively movable jaws

Means to actuate jaw

269157, 269265, B25B 100

Patent

active

056579756

ABSTRACT:
A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion molded into the electrically non-conductive material of the clip head behind a front face thereof, whereby the spring and clip head form a monolithic assembly.

REFERENCES:
patent: 4306731 (1981-12-01), Shaw
patent: 4643409 (1987-02-01), Hamatani
patent: 4911597 (1990-03-01), Maydan et al.
patent: 4915367 (1990-04-01), Carossino
patent: 4995063 (1991-02-01), Enoki et al.
patent: 5040484 (1991-08-01), Mears et al.
patent: 5083364 (1992-01-01), Olbrich et al.
patent: 5116181 (1992-05-01), Severns et al.
patent: 5183245 (1993-02-01), DiNapoli et al.
patent: 5224809 (1993-07-01), Maydan et al.
patent: 5253411 (1993-10-01), DiNapoli et al.
patent: 5280983 (1994-01-01), Maydan et al.

Affiliated with

Also associated with

Rating

Clip head apparatus for retaining a semiconductor wafer on a ped does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clip head apparatus for retaining a semiconductor wafer on a ped, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clip head apparatus for retaining a semiconductor wafer on a ped will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1099542