Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-12-17
1995-06-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
324754, 439912, H01R 2372
Patent
active
054236886
ABSTRACT:
A clip is described for making connections to the leads of an IC device whose leads are very closely spaced, which can be constructed reliably and at low cost. The clip includes a flat cable (112, FIG. 8) mounted on a clip frame (44), the cable having parallel conductors (114) mounted on a continuous insulative film (116), with lower portions of the conductors exposed to serve as lead-engaging contacts (50). The film is thin in a lateral direction (154) to easily bend and allow differential deflection of the contacts, while the conductors are thick in a lateral direction to minimize the influence of the film on conductor deflection. The frame of the clip has a cavity (46) with side and end walls that closely align with the body (14) of the IC device without an interference fit thereto. A pair of pivoting arms (34, 36, FIG. 2) press against the opposite ends of an IC device to lock the clip but not to align it. A contact arrangement that includes the flat cable, includes a header ( 122, FIG. 3) whose housing has an inner surface lying facewise against the flat cable and with the flat cable lying facewise against a largely vertical flat surface (132) on the frame.
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Abrams Neil
IT&T Industries, Inc.
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