Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-06-22
2001-05-08
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S709000, C361S710000, C257S717000, C257S719000, C257S727000, C174S016300, C165S080300
Reexamination Certificate
active
06229705
ABSTRACT:
BACKGROUND
1. Field of the Invention
The present invention relates to an apparatus for securing a heat sink to an electronic device package, and particularly to a clip which easily assembles/disassembles the heat sink to/from the package.
2. The Related Art
A heat sink is usually placed in contact with an electronic device package for dissipating heat from the electronic device package. Various clips have been used for attaching a heat sink to an electronic device package.
FIGS. 5 and 6
show a conventional clip
1
for attaching a heat sink
9
to a computer central processing unit (not labeled) retained by a socket assembly
8
to dissipate heat from the central processing unit. The clip
1
comprises a horizontal portion
2
and a pair of spring portions
3
extending from opposite ends of the horizontal portion
2
. A pair of legs
4
extends downwards respectively from the spring portions
3
. Each leg
4
defines two apertures
5
,
6
arranged one above the other. The lower apertures
5
receive corresponding catches (not shown) formed on the socket assembly
8
. A pair of handle tabs
7
extends from bottom edges of the upper apertures
6
for facilitating engagement of the clip
1
with the catches of the socket assembly
8
.
An operator assembling the clip
1
to the socket assembly may get injured when manually pushing the handle tabs
7
during mounting the clip
1
to the socket assembly
8
. Additionally, the mounting efficiency of the clip is low. Furthermore, while such a clip may be mounted to the socket assembly using a tool, the tool could easily slide down and scratch and damage a printed circuit board on which the socket assembly
8
is mounted.
The present invention solves these and other problems of the prior art by providing a clip which attaches a heat sink to an electronic device package simply and reliably.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a clip having a plastic handle which can readily attach/detach the heat sink to/from the electronic package.
To achieve the above-mentioned object, a clip in accordance with the present invention comprises a metal fastener and a plastic handle. The fastener comprises a body and first and second arms extending from opposite ends of the body. At least one protrusion extends from the second arm. The handle comprises an operation section and a joint section extending downwards from the operation section. The joint section defines a receiving space for interferentially receiving the protrusion of the fastener thereby fixing the handle to the fastener. Flanges extend from opposite edges of the body and are bent to overlap the body for reinforcing the body. Alternatively, a rib is formed on the body for reinforcement purposes.
Other objects, advantages and novel features of the present invention will be apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings, in which:
REFERENCES:
patent: 5396402 (1995-03-01), Perugini et al.
patent: 5594624 (1997-01-01), Clemens et al.
patent: 5602719 (1997-02-01), Kinion
patent: 5617292 (1997-04-01), Steiner
patent: 5933325 (1999-08-01), Hou
patent: 5933326 (1999-08-01), Lee et al.
Chervinsky Boris L.
Chung Wei Te
Foxconn Precision - Components Co., Ltd.
Picard Leo P.
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