Clip for retaining a heat sink on a chip

Details Clip for retaining a heat sink on a chip Clip for retaining a heat sink on a chip

1999-10-19

2000-09-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361707, 257718, 257719, 165 802, 165 803, 174 163, 24625, 248505, H05K 720

Patent

active

061186619

ABSTRACT:
A clip is configured for retaining a heat sink on a chip and socket combination. The clip includes an arcuate pressing portion, first and second engaging arms downwardly extending from opposite ends of the arcuate pressing portion, and a driving arm generally upwardly extending from a lower end of the second engaging arm. The clip engages with the socket by openings in the first and second engaging arms receiving projections on opposite edges of the socket. The arcuate pressing portion downwardly presses the heat sink toward the chip. The second engaging arm defines a slit above the hole thereof to reduce the rigidity thereof and the driving arm forms a rib to increase the rigidity thereof, thereby the driving arm having a greater rigidity than the second engaging arm. The driving arm is downwardly and outwardly movable to disengage the second engaging arm from the socket.

REFERENCES:
patent: 5486981 (1996-01-01), Blomquist
patent: 5600540 (1997-02-01), Blomquist
patent: 5602719 (1997-02-01), Kinion
patent: 5933325 (1999-08-01), Hou
patent: 5933326 (1999-08-01), Lee et al.
patent: 5953212 (1999-09-01), Lee

Affiliated with

Also associated with

Rating

Clip for retaining a heat sink on a chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clip for retaining a heat sink on a chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clip for retaining a heat sink on a chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-101690