Clip for heat dissipation device

Details Clip for heat dissipation device Clip for heat dissipation device

2001-05-23

2002-04-16

Picard, Leo P. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S016300, C165S080300, C257S718000, C257S719000, C257S727000

Reexamination Certificate

active

06373704

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to securing of heat dissipation devices, and particularly to a clip which is adjustable to ensure that a heat dissipation device can be securely attached to a heat-generating electronic device.
2. Description of Related Art
A computer central processing unit (CPU) is the core administrator of electrical signals in many contemporary computers. Continued development of CPUs has enabled them to perform more and more functions. Correspondingly, heat generated by CPUs is constantly increasing. This can adversely affect the operational stability of computers. Measures must be taken to efficiently remove the heat from the CPU. Typically, a heat dissipation device having great heat conductivity is mounted on the CPU to remove heat therefrom. A clip is frequently used to facilitate firm attachment of the heat dissipation device to the CPU, thus achieving greater efficiency of heat dissipation.
A conventional clip is shown in FIG.
5
. The clip
10
comprises a central horizontal pressing portion
109
, a pair of opposite spring arms
102
extending upwardly from the pressing portion
109
, and a pair of latching portions
103
respectively depending from the spring arms
102
. Each latching portion
103
has an operating element
106
extending upwardly therefrom, and defines an opening
105
below the operating element
106
. The operating elements
106
facilitate engagement of the openings
105
with corresponding catches, to thereby secure the heat dissipation device to a CPU.
Unfortunately, manual pulling of the operating elements
106
of the latching portions
103
easily hurts an operator's hands. Furthermore, long-term use under conditions of normal levels of vibration tends to cause the clip
10
to deform. This lessens the tension of the clip
10
, and frequently results in the heat dissipation device moving relative to the CPU. Another disadvantage is that the clip
10
must be manufactured to unduly precise dimensions, to ensure that the clip
10
can attain the requisite tension. Even if there is little departure from the narrow tolerances, the clip
10
cannot properly secure the heat dissipation device to the CPU.
Thus, an adjustable clip which can overcome the above-mentioned problems is strongly desired.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a clip which is adjustable to ensure that a heat dissipation device can be safely, securely and reliably attached to an electronic device.
Another object of the present invention is to provide a clip which is easy and cost-efficient to manufacture.
In order to achieve the objects set out above, a clip of the present invention comprises a body and a bolt. The body comprises a central pressing portion for pressing a heat dissipation device onto a CPU, a pair of first and second spring arms extending upwardly from the pressing portion, and a pair of first and second latching portions for engaging with a socket. The second latching portion forms a spring portion extending outwardly from a central section thereof. The spring portion defines a through hole with screw threads. The bolt is inserted into the through hole so that a height of the second latching portion can be resiliently adjusted by changing the extent of insertion of the bolt. Thus, the heat dissipation device can be securely attached to the CPU.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 5710694 (1998-01-01), Chen
patent: 6266245 (2001-07-01), Wei

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