Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-08-06
2000-07-18
Luebke, Renee
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 74, H01R 909
Patent
active
060898763
ABSTRACT:
A connectable plate (2) is mounted on an upper surface of a horizontal portion (the uniform thickness portion) (1b) of a housing (1). A plurality of contacts (3) mounted on the housing come into contact with a pattern of the connectable plate. A clip (4) has a U-shaped cross-sectional configuration. A spacing of a resilient forked portion of the contacts (an opening width) is larger than the thickness of the connectable plate but smaller than the sum of the thickness of the connectable plate and the thickness of the uniform thickness portion. When the clip is mounted to the connectable plate and the housing, an insulating coating portion (4d) of the clip slides onto the upper surface of the connectable plate, and a connector-housing-side end portion (4b) of the clip presses against an inclined portion (1a) of the housing. Thus, the opening width of the clip becomes larger, so that the connector-housing-side end portion slides smoothly onto the lower surface of the uniform thickness portion. As a result, the clip holds the connectable plate and the housing, and does not cause damage to either the connectable plate or to the clip connector.
REFERENCES:
patent: 5209671 (1993-05-01), Sugimoto et al.
patent: 5517752 (1996-05-01), Sakata et al.
patent: 5888076 (1999-03-01), Itoh et al.
Bilsback et al, Plasmma Panel display Present Unique Packing Problem, IBM Corporation, Sep. 1986.
Abe Hiroki
Ibaraki Kazuaki
Ishiyama Yoshiaki
Komachi Masahiko
Kuwahara Takashi
Duverne J. F.
Japan Aviation Electronics Industry Limited
Luebke Renee
Whitesel J. Warren
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