Clip and pin field for IC packaging

Details Clip and pin field for IC packaging Clip and pin field for IC packaging

1998-02-23

2002-05-07

Cheng, Joe H. (Department: 3713)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S837000, C165S080300, C165S185000, C174S016300, C257S685000, C257S686000, C257S704000, C257S710000, C361S600000, C361S679090, C361S688000

Reexamination Certificate

active

06381836

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic package assembly.
2. Description of Related Art
Integrated circuits are typically assembled to a package that is mounted to a printed circuit board.
FIG. 1
shows an integrated circuit package
1
attached to a zero insertion force (ZIF) socket
2
which allows an end user to replace the package
1
with a new part. The socket
2
has a plurality of pins
3
that are soldered to a motherboard
4
. Extending from the bottom surface of the integrated circuit package
1
are a plurality of external pins (not shown) that are plugged into the pin sockets
3
. The pins and pin sockets
3
couple the package
1
to the board
4
. The integrated circuit package
1
is inserted into a socket lid
5
that is laterally shifted by a cam lever
6
to couple the package to the pin sockets
3
.
The integrated circuit within the package
1
generates heat which must be removed to maintain the junction temperatures of the circuit below threshold values. A heat sink
7
may be coupled to the socket
2
by a spring clip
8
that is attached to a tab
9
.
It may be desirable to incorporate a fan into the electronic assembly shown in
FIG. 1
to increase the thermal efficiency of the assembly. Attaching a fan to the heat sink would be impractical with the present spring clip arrangement.
SUMMARY OF THE INVENTION
The present invention is an electronic assembly that incorporates a heat sink. The assembly may include an integrated circuit package that is mounted to a substrate. The substrate may be mounted to a spacer block which includes a pin field that contains a plurality of pins. The heat sink may be coupled to the integrated circuit package by a clip that wraps around the sink and is attached to the spacer block.


REFERENCES:
patent: 4744143 (1988-05-01), Sadigh-Behzadi
patent: 4812733 (1989-03-01), Tobey
patent: 5398041 (1995-03-01), Hyatt
patent: 5424913 (1995-06-01), Swindler
patent: 5432526 (1995-07-01), Hyatt
patent: 5448449 (1995-09-01), Bright et al.
patent: 5457342 (1995-10-01), Herbst, II
patent: 5475564 (1995-12-01), Chiou
patent: 5542468 (1996-08-01), Lin
patent: 5594623 (1997-01-01), Schwegler
patent: 5600540 (1997-02-01), Blomquist
patent: 5619399 (1997-04-01), Mok
patent: 5660562 (1997-08-01), Lin
patent: 5694297 (1997-12-01), Smith et al.
patent: 5703753 (1997-12-01), Mok
patent: 5704212 (1998-01-01), Erler et al.
patent: 5771960 (1998-06-01), Lin
patent: 5864465 (1999-01-01), Liu
patent: 5890371 (1999-04-01), Rajasubramanian et al.
patent: 5934079 (1999-08-01), Han et al.

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