Clip and heat dissipation assembly using the same

Details Clip and heat dissipation assembly using the same Clip and heat dissipation assembly using the same

2007-12-18

2010-06-29

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S709000, C257S727000, C165S080300, C165S185000

Reexamination Certificate

active

07746647

ABSTRACT:
A clip (50) for securing a heat dissipating device to a heat source comprises a spring arm (510) and an ear (530). The spring arm comprises two wires (512) substantially parallel to each other, a hook (514) formed at one end of the spring arm to connect ends of the wires and two barbs (516) each formed at another end of each of the wires. A central portion of each of the wires projects downwardly. The ear comprises a main body (530a), two notches (532) in an upside of the main body and a clamping unit (537) at a downside of the main body. Each of the notches comprises from above to below an insertion slot (5321), an elongated sliding slot (5323) and a retaining slot (5325). The spring arm engages with the ear with the barbs extending into the insertion slots, and the wires are slideable downwardly along the sliding slots to be fixed in the retaining slots.

REFERENCES:
patent: 5323845 (1994-06-01), Kin-shon
patent: 5448449 (1995-09-01), Bright et al.
patent: 5600540 (1997-02-01), Blomquist
patent: 5640305 (1997-06-01), Smithers
patent: 5671118 (1997-09-01), Blomquist
patent: 5933326 (1999-08-01), Lee et al.
patent: 5953212 (1999-09-01), Lee
patent: 6229705 (2001-05-01), Lee
patent: 6414846 (2002-07-01), Chen
patent: 6418022 (2002-07-01), Chen
patent: 6717814 (2004-04-01), Li
patent: 6775138 (2004-08-01), Lee et al.
patent: 6778395 (2004-08-01), Dong et al.
patent: 6785136 (2004-08-01), Chang et al.
patent: 6788538 (2004-09-01), Gibbs et al.
patent: 7167369 (2007-01-01), Huynh et al.
patent: 7180746 (2007-02-01), Yu et al.
patent: 7215550 (2007-05-01), Yang et al.
patent: 7236369 (2007-06-01), Barina et al.
patent: 7283361 (2007-10-01), Lee et al.
patent: 7283367 (2007-10-01), Yu et al.
patent: 7286362 (2007-10-01), Yu et al.
patent: 7375965 (2008-05-01), Xia et al.
patent: 7515419 (2009-04-01), Li et al.
patent: 2001/0002160 (2001-05-01), Bookhardt et al.
patent: 2004/0001315 (2004-01-01), Li
patent: 2004/0179340 (2004-09-01), Lin
patent: 2005/0066487 (2005-03-01), Zhang
patent: 2005/0174739 (2005-08-01), Chen et al.
patent: 2006/0133038 (2006-06-01), Yu et al.
patent: 2007/0127214 (2007-06-01), Chen
patent: 2008/0144289 (2008-06-01), Desrosiers et al.

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