Cleaving of diode arrays with scribing channels

Severing by tearing or breaking – Severing by manually forcing against fixed edge – Zigzag-folded supply package

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357 45, 357 32, 357 40, 225 2, 156647, 156662, 437 65, 437226, H01L 3300

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050538365

ABSTRACT:
A relatively wide scribing channel is provided between the ends of each adjacent pair of diode array areas on a wafer to expose the epitaxial layer of the wafer. A scribing groove is then scribed in the scribing channel to define a cleavage line along which the array areas are separated.

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McDermott et al., "Fabricating Monolithic Display Array," IBM Technical Disclosure Bulletin, vol. 12, No. 6, Nov. 1969, pp. 881-882.

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