Cleaning wafer substrates of metal contamination while maintaini

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 2, C23G 102

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active

054982936

ABSTRACT:
Process for cleaning wafer substrates of metal contamination while maintaining wafer smoothness by contacting the wafer substrates with a cleaning composition comprising an aqueous, metal ion-free base and an amphoteric surfactant and optionally a metal complexing agent and a propylene glycol ether organic solvent.

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