Cleaning substrate of substrate processing equipment and...

Details Cleaning substrate of substrate processing equipment and... Cleaning substrate of substrate processing equipment and...

2005-10-19

2009-08-18

Nakarani, D. S (Department: 1794)

Stock material or miscellaneous articles

Composite

Of polyimide

C134S004000, C134S006000, C134S008000, C428S343000, C428S3550EN

Reexamination Certificate

active

07575812

ABSTRACT:
The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107Pa to 1×109Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

REFERENCES:
patent: 4929716 (1990-05-01), Tyrell et al.
patent: 2 346 634 (2000-04-01), None
patent: 1328588 (2001-12-01), None
patent: 5-170901 (1993-07-01), None
patent: 6-73178 (1994-03-01), None
patent: 6-207024 (1994-07-01), None
patent: 2001-351960 (2001-12-01), None
patent: 2002-18377 (2002-01-01), None
patent: 2002-50854 (2002-02-01), None
Chinese Office Action dated Nov. 23, 2007.

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