Cleaning solution for cleaning substrates to which a metallic wi

Details Cleaning solution for cleaning substrates to which a metallic wi Cleaning solution for cleaning substrates to which a metallic wi

1998-08-11

2000-06-27

Kopec, Mark

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

510181, 510197, 510202, 510203, 510206, 510218, 510245, 510247, 510253, 510254, 510255, 510398, 510434, 510477, 510480, 134 12, 134 13, C11D 330, C11D 708, C11D 333

Patent

active

060807091

ABSTRACT:
The present invention relates to a cleaning solution for cleaning substrates, to which a metallic wiring has been applied, being capable of easily removing the metallic impurities of the substrate surface without corroding the metal, not putting a strain on the environment, and not causing a shelf life problem.
The cleaning solution comprising at least one member selected from a group consisting of oxalic acid, ammonium oxalate and polyaminocarboxylic acids, but contains no hydrogen fluoride.

REFERENCES:
patent: 4209418 (1980-06-01), Anderson
patent: 4226640 (1980-10-01), Bertholdt
patent: 4357254 (1982-11-01), Kapiloff et al.
patent: 4452643 (1984-06-01), Martin et al.
patent: 4822854 (1989-04-01), Ciolino et al.
patent: 5108514 (1992-04-01), Kisner
patent: 5154197 (1992-10-01), Auld et al.
patent: 5759437 (1998-06-01), Datta et al.
U.S. application No. 08/275,632, Krusell, filed 1994.

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