Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2007-09-11
2009-11-24
Webb, Gregory E (Department: 1796)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S002000, C510S175000
Reexamination Certificate
active
07621281
ABSTRACT:
A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C):(A) an ethyleneoxide-type surfactant containing a hydrocarbon group which may have a substituent group except for phenyl, and a polyoxyethylene group in which a ratio (m
) of a number (m) of carbon atoms contained in the hydrocarbon group to a number (n) of oxyethylene groups contained in the polyoxyethylene group is in the range of 1 to 1.5, the number (m) of carbon atoms is not less than 9, and the number (n) of oxyethylene groups is not less than 7;(B) water; and(C) alkali or an organic acid.
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Ikemoto Makoto
Kawase Yasuhiro
Morinaga Hitoshi
Mitsubishi Chemical Corporation
Nixon & Vanderhye P.C.
Webb Gregory E
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