Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2005-03-08
2005-03-08
Markoff, Alexander (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S033000, C134S034000, C134S037000, C134S095100, C134S095300, C134S102100, C134S153000, C134S099100, C134S902000
Reexamination Certificate
active
06863741
ABSTRACT:
Where a substrate such as a semiconductor wafer held in a process space in a process chamber consisting of an outside chamber and an inside chamber is subjected to a cleaning processing, a chemical agent such as IPA or a solvent having a surfactant added thereto is supplied in the form of a mist or a vapor toward the substrate under the sate that the substrate is stopped or rotated at a low speed after processing with a chemical agent and a subsequent rinsing processing with a pure water. After the supply of the chemical agent is stopped, the substrate is rotated at a rotating speed higher than said low speed so as to centrifugally remove the chemical agent attached to the substrate.
REFERENCES:
patent: 5487398 (1996-01-01), Ohmi et al.
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patent: 6491764 (2002-12-01), Mertens et al.
patent: 6568408 (2003-05-01), Mertens et al.
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patent: 2001-70861 (2001-03-01), None
Nakamori Mitsunori
Orii Takehiko
Markoff Alexander
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
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