Cleaning processing method and cleaning processing apparatus

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents

Reexamination Certificate

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Details

C134S033000, C134S034000, C134S037000, C134S095100, C134S095300, C134S102100, C134S153000, C134S099100, C134S902000

Reexamination Certificate

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06863741

ABSTRACT:
Where a substrate such as a semiconductor wafer held in a process space in a process chamber consisting of an outside chamber and an inside chamber is subjected to a cleaning processing, a chemical agent such as IPA or a solvent having a surfactant added thereto is supplied in the form of a mist or a vapor toward the substrate under the sate that the substrate is stopped or rotated at a low speed after processing with a chemical agent and a subsequent rinsing processing with a pure water. After the supply of the chemical agent is stopped, the substrate is rotated at a rotating speed higher than said low speed so as to centrifugally remove the chemical agent attached to the substrate.

REFERENCES:
patent: 5487398 (1996-01-01), Ohmi et al.
patent: 5882433 (1999-03-01), Ueno
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6568408 (2003-05-01), Mertens et al.
patent: 6589359 (2003-07-01), Kamikawa et al.
patent: 2001-70861 (2001-03-01), None

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