Cleaning process for semiconductor die

Details Cleaning process for semiconductor die Cleaning process for semiconductor die

1976-02-19

1976-12-14

Bashore, S. Leon

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

51313, 134 25R, 134 33, B08B 700

Patent

active

039973581

ABSTRACT:
A method for removing slag and debris from the surfaces of laser scribed semiconductor die is provided in which the die and glass or metal beads are placed into a cylindrical wire mesh basket and the basket is turned causing the beads and die to mechanically mix. The mechanical mixing action removes debris and slag which subsequently falls through the wire mesh of the basket so that the die surfaces are not marred.

REFERENCES:
patent: 458571 (1891-09-01), Gedge
patent: 631133 (1899-08-01), Starke
patent: 1678359 (1928-07-01), Schulte
patent: 2387141 (1945-10-01), Fruth
patent: 2425984 (1947-08-01), Blackman
patent: 2851829 (1958-09-01), Martin

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