Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2006-08-04
2011-12-20
Markoff, Alexander (Department: 1711)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S026000, C134S010000, C134S011000, C134S012000
Reexamination Certificate
active
08080114
ABSTRACT:
Provided is a cleaning process which is simplified and in which a time required for the cleaning process is reduced and which has an excellent cleaning effect. The cleaning process comprises loading a wafer in a high pressure cleaner, injecting high-purity gaseous carbon dioxide (CO2) having low pressure into the high pressure cleaner, injecting CO2having lower pressure than supercritical cleaning pressure into the high pressure cleaner, cleaning the wafer by injecting a supercritical homogeneous transparent phase mixture in which a cleaning additive and supercritical CO2are mixed, into the high pressure cleaner under a supercritical cleaning pressure, rinsing the wafer by injecting a supercritical rinsing mixture in which a rinsing additive and supercritical CO2are mixed, into the high pressure cleaner, and separating CO2from a mixture discharged from the high pressure cleaner.
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Han Gap Su
Kwon Young Hoon
Lim Jong Sung
Yoo Ki Pung
Frommer & Lawrence & Haug LLP
Industry-University Cooperation Foundation Sogang University
Markoff Alexander
Santucci Ronald R.
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