Cleaning process

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

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Details

510176, 510177, 510178, 510407, 510409, 510436, 510467, 510493, 510500, B08B 308, C23G 5036, C23G 5032, C23G 5024

Patent

active

057670480

ABSTRACT:
A cleaning process which comprises contacting a printed circuit board to which a residue of a flux is attached with a cleaning composition containing a first solvent and an organic compound, and then with a second solvent. The first solvent is an aliphatic hydrocarbon solvent having 5 to 20 carbon atoms. The organic compound is a 1-alkyl-2-pyrrolidone having 3 to 18 carbon atoms, a tri-alkylphosphine oxide having 3 to 8 carbon atoms or a di-alkylsulfoxide having 3 to 8 carbon atoms. The organic compound is in an amount of 10 to 300 g per liter of the hydrocarbon solvent. The cleaning composition does not contain a halogen compound.

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