Cleaning of silicon wafers with an aqueous solution of KOH and a

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 38, 134 42, 252 791, 252 795, 252156, 252173, 252541, 252545, 252547, 252DIG14, 430327, 430331, B08B 308, C11D 706, C11D 732, C11D 734

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049649191

ABSTRACT:
Composition of matter and method of cleaning silicon wafers; the composition of matter is an aqueous solution of potassium hydroxide and a nitrogen-containing compound, preferably tetramethylammonium hydroxide. The wafer is immersed in the solution, rinsed and dried.

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