Cleaning of high aspect ratio through holes in multilayer printe

Details Cleaning of high aspect ratio through holes in multilayer printe Cleaning of high aspect ratio through holes in multilayer printe

1977-12-12

1979-05-22

Caroff, Marc L.

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 22R, 134 22C, 134 26, 134 28, 134 37, 156644, B08B 308

Patent

active

041557751

ABSTRACT:
A cleaning process for high aspect ratio through holes of multilayer printed circuit boards assures the removal of any loosened fiberous material or epoxy smears in the through holes and also provides an inverted "T" structure at the innerplanes of the internal conductive circuits within the printed circuit board sandwich. The inverted "T" structure helps to move the contact point between the plating of the through hole and the internal circuit lines further into the circuit board, thereby eliminating the "Z" stress at the edge of the innerplane. This process is accomplished by first vapor blasting the through holes, soaking the board in a suitable solvent to loosen any fibers or smears on the circuit innerplanes of the board, removing the excess solvent from the through holes and then feeding a unilateral stream of a cleaning solution through the holes, the cleaning solution operating to remove excess fibers and smears in the through holes and to produce a slight, uniform etchback of the metal innerplanes of the printed circuit boards. Thereafter, the solution may be reduced and any excess cleaning solution is removed.

REFERENCES:
patent: 3462832 (1969-08-01), Kubik
patent: 3653997 (1972-04-01), Rothschild et al.
patent: 4012307 (1977-03-01), Phillips

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