Cleaning method and apparatus for the same

Details Cleaning method and apparatus for the same Cleaning method and apparatus for the same

1997-03-26

2000-03-21

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 1, 134 13, 134 3, 134 26, 134 28, 134 29, 134902, C03C 2300, B08B 300

Patent

active

060398159

ABSTRACT:
An aqueous oxidizing acidic cleaning solution or an aqueous oxidizing alkaline cleaning solution is produced by mixing an acidic or alkaline solution with ozone water. An aqueous reducing acidic cleaning solution or an aqueous reducing alkaline cleaning solution is produced by mixing an acidic or alkaline solution with hydrogen water. Each of these aqueous cleaning solutions has effective cleaning power and the ORP and pH values thereof are separately controlled. Therefore, by selecting an appropriate aqueous cleaning solution according to the types of contaminants adhering to subjects during each manufacturing step, a plurality of types of contaminants can be removed by washing with one type of aqueous cleaning solution.

REFERENCES:
patent: 5190627 (1993-03-01), Saito et al.
patent: 5599438 (1997-02-01), Shiramizu et al.
patent: 5616221 (1997-04-01), Aoki et al.
patent: 5635053 (1997-06-01), Aoki et al.
patent: 5676760 (1997-10-01), Aoki et al.
patent: 5806126 (1998-09-01), Larios et al.
Yagi et al, Advanced Ultrapure Water System with Low Dissolved Oxygen for Native Oxide Free Wafer Processing, IEEE Transactions on Semicondcutor Manufacturing, vol. 5, No. 2, pp. 121-127, May 1992.
Handbook of Semiconductor Wafer Cleaning Technology, Noyes Publications, pp. 48-59 and 119-128, 1993.

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